Usado Máquina De Corte De Oblea

Okamoto ADM6D

• Fabricante: Okamoto
• Modelo: ADM-6D

Application: Dicing for 6 inch | Axis/block: Item | Work size: ��6" (��152.4mm) | X-axis: Useable stroke | Cut speed: 0.1~250 | Y-axis: Useable stroke | Indexing step: 0.001 | Z-axis: Maximum cutting stroke | Min...

DYNATEX INTERNATIONALTM DX-III

• Fabricante: Dynatex
• Modelo: DX-III

Application: Scribing | Automatic: Capable of complete, automatic scribing and breaking of many substrate materials | Cost effective: - System integration allows easy hook-up and transport - Superior yield and im...

K&S 980

• Fabricante: Kulicke & Soffa

DX485C Multi-wire Saw

• Fabricante: Beijing Sinopoly Technology

DX2231HC Multi-wire Saw

• Fabricante: Beijing Sinopoly Technology

YBDX160 Diamond Multi-wire Saw

• Fabricante: Beijing Sinopoly Technology

Disco DAD321 Wafer Saw Dicing Saw Wafer Dicing Machine

• Fabricante: Disco
• Modelo: DAD321

Teikoku Wafer detaping machine EXR-1200 F2 Tape Remover

• Fabricante: Teikoku

TSK A-WD-300T Dicing Saw Wafer Saw Wafer Dicing Machine Scribing Machine 12 inches

• Fabricante: Accretech - Tokyo Seimitsu - TSK
• Modelo: A-WD-300T

Disco 12 inches Wafer Saw DFD6360 12-inch Wafer Dicing Machine

• Fabricante: Disco
• Modelo: DFD6360

Disco DAD341 8 inches wafer saw 8 inches cutting machine Scribing machine

• Fabricante: Disco
• Modelo: DAD341

TSK A-WD-200T Dicing Saw Wafer Saw 8" Wafer Dicing Machine Scribing Machine

• Fabricante: Accretech - Tokyo Seimitsu - TSK
• Modelo: A-WD-200T

TSK A-WD-100A Dicing Saw Wafer Dicing Machine

• Fabricante: Accretech - Tokyo Seimitsu - TSK
• Modelo: A-WD-100A

Disco DFL7160 Laser Saw

• Fabricante: Disco
• Modelo: DFL7160