Double side lapping and polishing machine en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- Categoría
- Rectificadoras en China
- Subcategoría
- Grinding and polishing machine
- Subcategoría 2
- Grinding and polishing machine
- ID de Anuncio
- 104406200
Descripción
1. Equipment Introduction
1. This machine is mainly used for high-precision double-sided grinding or polishing of silicon wafers, gallium arsenide wafers, ceramic wafers, quartz crystals and other semiconductor materials. It is also suitable for high-precision double-sided grinding or polishing of other hard, brittle and thin materials such as metals, non-metals, optical glass, sapphire, etc.
2. The grinding disc is cast with QT600-3 and milled into 25x25 (mm) squares with a groove width of 2mm.
3. The liquid collecting tank is made of 304 stainless steel and is equipped with a liquid circulation filtration and stirring system.
4. The machine is equipped with a self-lubricating system.
2. Equipment Features
1. The machine body structure is optimized and the frame adopts a gantry structure with good rigidity and strong pressure bearing capacity, which can meet the requirements of high-speed and stable operation under high load.
2.