MDXN-25D4 High precision mask aligner en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- 1. exposure type
- single side exposure
- 2. exposure area
- 110X110mm;
- 3. exposure uniformity
- ≥ 97%;
- 4. exposure intensity
- 0-30mw/cm2 adjustable;
- 5. uv beam angle
- ≤ 3 °
- 6. central wavelength of ultraviolet light
- 365nm;
- 7. uv light source lifespan
- ≥ 20000 hours;(2 years warranty)
- 9. exposure resolution
- 1 μ M
- 12. alignment accuracy
- 1um (under good environment condition)
- 13.separation distance range
- 0-50um adjustable.
- 14.exposure method
- contact exposure.(hard/soft/micro touch)
- 15.balance method
- Air flotation.
- 17. mask size
- 127*127mm;102*102mm
- 18. substrate size
- Φ102mm;Φ76mm
- 19. substrate thickness
- ≤1mm
- 20.exposure time
- 0-999.9 seconds adjustable.
- 21.power
- 220V 50Hz 1.5kw.
- 23.vacuum degree
- -0.07MPa~-0.09Mpa
- Categoría
- Mask Aligners en China
- ID de Anuncio
- 91750802
Descripción
MDXN-25D4 High
precision mask aligner
Purpose and characteristics
This equipment is
mainly used for the development and production of small and medium-sized
integrated circuits, semiconductor components, and surface acoustic wave
devices. Due to the advanced leveling mechanism and low leveling force, this
machine is not only suitable for the exposure of various types of substrates,
but also for the exposure of easily fragmented substrates such as potassium
arsenide and phosphate steel, as well as the exposure of non circular and small
substrates.
Main technical parameters
8. Adopting
electronic shutter;
10.Camara view
range: ± 15mm Y: ± 15mm
11. Alignment
range: x: ± 4mm Y: ± 4mm Q:±3°.
16. Microscopic
system: dual field of view CCD system, objective lens 1.6X~10X, computer image
processing system, 19 "LCD monitor; Total magnification 91-570x. distance
of objective : 50-120mm.
22.air
source?0.4Mpa