MDHS-AL8 8" Fully automatic single-sided lithography machine en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- 1. working mode
- The loading robot automatically loads wafers from the A-B (recyclable) wafer box to the pre positioning workbench, and through the adjustment of the camera positioning wafer and automatic rotation system, the pre positioning of the wafer is achieved; The loading robot then loads the pre positioned wafers onto the alignment workbench. Through computer image recognition and automatic alignment system adjustment, the automatic alignment of the graphics on the mask and the wafers can be achieved. It is also possible to complete one exposure without aligning the graphics. After automatic exposure by the overexposure system, the unloading robot automatically places the wafers into the C-D (recyclable) wafer box.
- 2. exposure area
- 160 × 160mm;
- 3. uneven exposure illuminance
- ≤ 3%;
- 4. exposure intensity
- 0~≥ 40mw/cm2 adjustable (beam angle 2 °);
- 5. uv beam angle
- ≤ 3 °;
- 6. center wavelength of ultraviolet light
- 365nm;
- 7. uv light source lifespan
- ≥ 20000 hours;
- 8. separation capacity
- 0~≥ 1000um adjustable;
- 9. alignment accuracy
- ≤ ± 1.5 μ M;
- 10. exposure accuracy
- Contact exposure ± 1 μ m. Near exposure separation of 20 μ M beam angle 2 ° ≤ ± 2 μ M
- 11. exposure methods
- hard contact, soft contact, and proximity exposure;
- 12. exposure mode
- You can choose between one-time exposure or offset exposure
- 13. pre positioning image recognition and automatic rotation system (including pre positioning workbench)
- rotation angle Q ≥ ± 180 °, rotation accuracy Q ≤ 0.01 °;
- 14. image recognition and automatic alignment system (including uvw alignment workbench)
- alignment range X Y ≥ ± 5mm, rotation angle Q ≥ ± 3 °, and two lenses of the microscope are controlled by two XYZ electric platforms.
- 15. mask size
- 5 " × 5 "and 7" × 7 ";
- 16. wafer size
- 4 "and 6";
- 17. upper and lower film box workstations
- dual workstations;
- 19. loading and unloading dual arm robotic arm
- Z ≥ 350mm, R135mm;
- 20. number of wafers in the wafer box
- determined based on the number of wafers in the customer's wafer box;
- 21. positioning table lifting
- Z ≥ ± 25mm;
- 22. exposure timing
- adjustable from 0 to 999.9 seconds;
- 23. production rhythm
- >120 pieces per hour;
- 24. power supply
- single-phase AC220V 50Hz, power consumption ≤ 3KW;
- 25. clean air pressure
- ≥ 0.4MPa;
- 26. vacuum degree
- -0.07MPa~-0.09MPa;
- 27. size
- 1400 * 1000 * 2100mm;
- 28. weight
- Approximately 400kg
- 2、 configuration
- This machine consists of an LED ultraviolet exposure head, an image recognition and automatic rotation system, a pre positioned workbench, and a picture
- 1) tracheal
- 15 meters
- 3) vacuum pump
- 1 unit
- Categoría
- Mask Aligners en China
- ID de Anuncio
- 91750806
Descripción
MDHS-AL8 8" Fully automatic single-sided lithography machine
1、 Technical parameters:
18. Foot cushion airbag
Like recognition and automatic alignment systems, alignment workbenches, loading robots, unloading robots, racks, and electrical control
Consisting of equipment, spare accessories, etc.
1. Exposure head:
One LED ultraviolet exposure head (365nm);
2. Image recognition and pre alignment workbench:
1) 1 camera (1.3 million pixels)
2) Center positioning fixture
3) 1 set of rotating platform (using servo motor)
4) 1 set of positioning system
3. Image recognition and automatic alignment system:
1) 2 cameras (5 million pixel high frame rate)
2) 2 lenses (4x high-definition lens)
3) One industrial computer
4) One controller (controlled by PLC)
5) One set of alignment platform (using 5-phase stepper motor)
6) A set of sports system
7) The top plate device adopts a motor for lifting and lowering
7) The software adopts the latest version of LabVIEW Professional Edition
4.