MDXN-31D4 High precision double-sided lithography machine en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- 1. exposure type
- contact type, plate alignment, double-sided single exposure
- 2. exposure area
- 110X110mm;
- 3. exposure uniformity
- ≥ 97%;
- 4. exposure intensity
- 0-30mw/cm2 adjustable;
- 5. uv beam angle
- ≤ 3 °
- 6. central wavelength of ultraviolet light
- 365nm;
- 7. uv light source lifespan
- ≥ 20000 hours;;
- 8. working surface temperature
- ≤ 30 ℃
- 10. exposure resolution
- 1 μ M (exposure depth is about 10 times the line width)
- 11. exposure mode
- Double sided simultaneous exposure
- 13. plate alignment accuracy
- 2 μ m
- 14. rotation range
- Q-direction rotation adjustment ≤ ± 5 °
- 15. microscopic system
- dual field of view CCD system, objective lens 1.6X~10X, computer image processing system, 19 "LCD monitor; Total magnification 91-570x
- 16. mask size
- Capable of vacuum absorbing 5 "square masks, with no special requirements for the thickness of the mask (ranging from 1 to 3mm).
- 17. substrate size
- Suitable for 4 "substrates, with substrate thickness ranging from 0.1 to 2mm.
- Categoría
- Mask Aligners en China
- ID de Anuncio
- 91751211
Descripción
MDXN-31D4 High
precision double-sided lithography machine
Purpose and characteristics
This equipment is
mainly used for the development and production of small and medium-sized
integrated circuits, semiconductor components, and surface acoustic wave
devices. Due to the advanced leveling mechanism and low leveling force, this
machine is not only suitable for the exposure of various types of substrates,
but also for the exposure of easily fragmented substrates such as potassium
arsenide and phosphate steel, as well as the exposure of non circular and small
substrates.
Main technical parameters
9. Adopting
electronic shutter;
12. Alignment
range: x: ± 5mm Y: ± 5mm
18. When
ordering, there are no special requirements, and a 5 "X5 shelf is
standard; you can customize shelves below 5" X5: