Nuevo Flip Chip Bonders

Automatic Wire and Chip Bonding Machine Made in China Card Antenna Machine

• Fabricante: JINGUAN

Automatic grade: Full-Automatic | Material: PVC Card | Read-write method: Simpass | Label category: Active | Application field: Finance | Power supply mode: Passive Card | Frequency: Ultrahigh Frequency | Data tr...

ACCµRA M: Nueva soldadura manual de flip-chip

ACCµRA100: Educación e I+D orientadas, Union de chip de alto rendimiento Flip-Chip

• Fabricante: Union

NEO HB: Nuevo Bonder Automático de Flip-Chip, Híbrido/ Directo

ACCµRA OPTO: Bajador de Flip-Chip de Alta Precisión 0,5 μm