Building Filters

Wafer-Level Burn-in
Chuck quantity: Octa Chuck | Package type: Silicon Carbide (SiC) Power Device | Wafer size: 6, 8 inch | Input/ output option: Wafer Cassette (Up to 2 cassettes) | Die per wafer burn-in parallelism: 4000 | Total b...
Penang, Malasia
3D Inspection Online AOI EKT-VL-200M
Detection ability: Applicable process; SMT after solder paste printing, SMT before/after reflow, DIP before/after wave soldering | Programming mode: Manual writing, automatic writing, CAD data import automatic co...
Shenzhen, China
3D Dual Track Online AOI EKT-VL-220M
Detection ability: Applicable process; SMT after solder paste printing, SMT before/after reflow, DIP before/after wave soldering | Programming mode: Manual writing, automatic search, CAD data import automatically...
Shenzhen, China
