Usado Microsoldadoras De Chips en Singapur

FC300: The High Force and High Accuracy Die Bonder for Large Devices

ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

FC150: The Most Flexible High Accuracy Die Bonder

ESEC 2008XP3 Die Bonder

• Fabricante: ESEC
• Modelo: 2008 xP3

ASM 8912 Die Bonder

ESEC 2006PI Epoxy Lead Frame Die Attach

• Fabricante: ESEC
• Modelo: 2006

ESEC 2008HS3+ Die Bonder

• Fabricante: ESEC
• Modelo: 2008

ASM 8930 Die Bonder Vintage: 2007

ESEC 2007 IC-8 Die Bonder

• Fabricante: ESEC
• Modelo: 2007

ESEC 2008HS Plus Die Bonder

• Fabricante: ESEC
• Modelo: 2008 HS Plus

ESEC 2100FC Flip-Chip Die Bonder

• Fabricante: ESEC
• Modelo: 2100 FC