Nuevo Mask Aligners en China

PCB solder mask exposure machine

No.: Modelo; especificación | 1: No. de modelo; NL2500-MSL-LED | 2: Tamaño de exposición efectivo; 1550*650mm | 3: Ventajas del equipo; Fuente de luz LED de ahorro de energía, tres años sin reemplazar la lámpara,...

MDXN-31D2 Mask aligner

5.exposure type: contacto tipo, alineación de placa, exposición doble cara; | 6.exposure area: φ100mm; | 7.uneven exposure: ≤±3%; | 8.exposure intensity: ≥5mw/cm2; | 9.exposure resolution: 2μm; | 10.exposure mode...

MDXN-25D Mask aligner

1.exposure type: lado único. | 2.exposure area: 110×110 mm. | 3.uneven exposure illumination: ≤±3%. | 4.exposure intensity: 0-30 mW/cm2 ajustable. | 5.uv beam angle: ≤3°. | 6.central wavelength of ultraviolet lig...

MDXN-43D4 High precision mask aligner

1. operation: Manual. | 2. exposure type: contact single side one time exposure | 3. exposure area: 110X110mm; with 4inch LED exposure head, one year warranty. | 4. central wavelength of ultraviolet light: 365nm;...

MDXN-25D4 High precision mask aligner

1. exposure type: single side exposure | 2. exposure area: 110X110mm; | 3. exposure uniformity: ≥ 97%; | 4. exposure intensity: 0-30mw/cm2 adjustable; | 5. uv beam angle: ≤ 3 ° | 6. central wavelength of ultravio...

MDXN-31D4 High precision double-sided lithography machine

1. exposure type: contact type, plate alignment, double-sided single exposure | 2. exposure area: 110X110mm; | 3. exposure uniformity: ≥ 97%; | 4. exposure intensity: 0-30mw/cm2 adjustable; | 5. uv beam angle: ≤ ...

MDHS-AL8 8" Fully automatic single-sided lithography machine

1. working mode: The loading robot automatically loads wafers from the A-B (recyclable) wafer box to the pre positioning workbench, and through the adjustment of the camera positioning wafer and automatic rotatio...

MCXJ-MLS8 Maskless lithography System Equipment specifications

Nota: Debido a la diferencia en el principio de exposición y longitud de onda, los parámetros de proceso de MCXJ-MLS8 pueden ser diferentes de los de las máquinas de exposición tradicionales. La resolución de la ...

MDLB-ASD2C2D automatic coating and developing machine

MDXN-25X High precision single side lithography machine

Light source: GCQ350Z ultra-high pressure mercury direct current mercury lamp is used. | Lighting range: ≤ ф 117mm | Exposure area: ф 100mm | A. hard contact exposure: Use pipeline vacuum to obtain high vacuum co...

Spin coater without temperature